A framework for rducational innovation in logistics and supply chain management, a research agenda

David Ernesto Salinas-Navarro, Agatha Clarice Da Silva Ovando, Christopher Mejía Argueta, Mario Chong

Resultado de la investigación: Capítulo del libro/informe/acta de congresoContribución a la conferenciarevisión exhaustiva

Resumen

This work presents a conceptual framework for educational innovation within Logistics and Supply Chain Management (LSCM) to develop relevant learning experiences in the discipline. Nowadays, education is shifting from traditional passive approaches in which students listen and see into active settings involving learn-by-doing real-life experiences to develop appropriate competencies. LSCM educational innovation commonly refers to fragmented aspects such as the appropriateness of contents or specific teaching methods; however, the educational model transformation has little attention and the recognition of a high pertinent and engaging learning. Therefore, we presented a comprehensive framework for educational innovation to define a structure of educational components to recreate active learning experiences. Finally, we described the implementation of this framework, the progression within the MIT SCALE Network in Latin America, and insights for future work.
Idioma originalInglés
Título de la publicación alojadaEDUNINE 2022 - 6th IEEE World Engineering Education Conference
Subtítulo de la publicación alojadarethinking engineering education after COVID-19: A path to the new normal, proceedings
EditoresClaudio da Rocha Brito, Melany M. Ciampi
EditorialInstitute of Electrical and Electronics Engineers Inc.
Número de páginas6
ISBN (versión digital)978-1-6654-8336-0
DOI
EstadoPublicada - 2022
EventoEdunine 2022 - VI IEEE World Engineering Education Conference -
Duración: 13 mar. 202216 mar. 2022
Número de conferencia: 2022
https://edunine.eu/edunine2022/

Conferencia

ConferenciaEdunine 2022 - VI IEEE World Engineering Education Conference
Título abreviadoEdunine
Período13/03/2216/03/22
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© 2022 IEEE.

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