Higher education internationalization: A Peruvian university experience

Ana Luna; Mario Chong; Djordje Djurica

doi:10.1109/EDUNINE57531.2023.10102851

Higher education internationalization: A Peruvian university experience

Producción científica: Capítulo del libro/informe/acta de congreso › Contribución a la conferencia › revisión exhaustiva

1 Cita (Scopus)

Resumen

Internationalization in higher education brings several benefits, including improving desirable skills and competencies in future professionals and developing their cultural sensibility and awareness of unknowing behaviors and environments. This strategic process makes it possible and strengthens the production of knowledge. Besides, it is transversal to research, teaching, and extension in a global mindset context. This work presents the internationalization experiences in the Engineering Department of a Private University in Peru. Additionally, we contribute with the 5W+H application analysis method for the planning and scope of the internationalization process. The purpose is to share experiences and disseminate best practices, as well as the lines to follow in the future.

Idioma original	Inglés
Título de la publicación alojada	EDUNINE 2023 - 7th IEEE World Engineering Education Conference
Subtítulo de la publicación alojada	Reimaging Engineering - Toward the Next Generation of Engineering Education, Merging Technologies in a Connected World, Proceedings
Editores	Claudio da Rocha Brito, Melany M. Ciampi
Editorial	Institute of Electrical and Electronics Engineers Inc.
ISBN (versión digital)	979-8-3503-2050-3
DOI	https://doi.org/10.1109/EDUNINE57531.2023.10102851
Estado	Publicada - 2023
Evento	Edunine 2023 - VII IEEE World Engineering Education Conference - Bogotá, Colombia Duración: 12 mar. 2023 → 15 mar. 2023 https://edunine.eu/edunine2023/

Conferencia

Conferencia	Edunine 2023 - VII IEEE World Engineering Education Conference
País/Territorio	Colombia
Ciudad	Bogotá
Período	12/03/23 → 15/03/23
Dirección de internet	https://edunine.eu/edunine2023/

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Publisher Copyright:
© 2023 IEEE.

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1 Artículo de revista

Higher education internationalization: A BPMN global experience
Luna, A., Chong, M. & Djurica, D., 20 set. 2024, (Publicación electrónica previa a su impresión) En: Revista Iberoamericana de Tecnologias del Aprendizaje.
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Luna, A., Chong, M., & Djurica, D. (2023). Higher education internationalization: A Peruvian university experience. En C. da Rocha Brito, & M. M. Ciampi (Eds.), EDUNINE 2023 - 7th IEEE World Engineering Education Conference: Reimaging Engineering - Toward the Next Generation of Engineering Education, Merging Technologies in a Connected World, Proceedings Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/EDUNINE57531.2023.10102851

Luna, Ana ; Chong, Mario ; Djurica, Djordje. / Higher education internationalization : A Peruvian university experience. EDUNINE 2023 - 7th IEEE World Engineering Education Conference: Reimaging Engineering - Toward the Next Generation of Engineering Education, Merging Technologies in a Connected World, Proceedings. editor / Claudio da Rocha Brito ; Melany M. Ciampi. Institute of Electrical and Electronics Engineers Inc., 2023.

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Luna, A , Chong, M & Djurica, D 2023, Higher education internationalization: A Peruvian university experience. En C da Rocha Brito & MM Ciampi (eds.), EDUNINE 2023 - 7th IEEE World Engineering Education Conference: Reimaging Engineering - Toward the Next Generation of Engineering Education, Merging Technologies in a Connected World, Proceedings. Institute of Electrical and Electronics Engineers Inc., Edunine 2023 - VII IEEE World Engineering Education Conference, Bogotá, Colombia, 12/03/23. https://doi.org/10.1109/EDUNINE57531.2023.10102851

Higher education internationalization: A Peruvian university experience. / Luna, Ana ; Chong, Mario; Djurica, Djordje.
EDUNINE 2023 - 7th IEEE World Engineering Education Conference: Reimaging Engineering - Toward the Next Generation of Engineering Education, Merging Technologies in a Connected World, Proceedings. ed. / Claudio da Rocha Brito; Melany M. Ciampi. Institute of Electrical and Electronics Engineers Inc., 2023.

Producción científica: Capítulo del libro/informe/acta de congreso › Contribución a la conferencia › revisión exhaustiva

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T1 - Higher education internationalization

T2 - Edunine 2023 - VII IEEE World Engineering Education Conference

AU - Luna, Ana

AU - Chong, Mario

AU - Djurica, Djordje

PY - 2023

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KW - Mobility

KW - Higher education

KW - Erasmus program

KW - Faculty-led program

KW - internationalization

KW - mobility

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KW - higher education

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PB - Institute of Electrical and Electronics Engineers Inc.

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Luna A , Chong M, Djurica D. Higher education internationalization: A Peruvian university experience. En da Rocha Brito C, Ciampi MM, editores, EDUNINE 2023 - 7th IEEE World Engineering Education Conference: Reimaging Engineering - Toward the Next Generation of Engineering Education, Merging Technologies in a Connected World, Proceedings. Institute of Electrical and Electronics Engineers Inc. 2023 doi: 10.1109/EDUNINE57531.2023.10102851

Higher education internationalization: A Peruvian university experience

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Producción científica

Higher education internationalization: A BPMN global experience

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